Custom High Quality 20W High-power Mobile Phone Wireless Charger Module Three-coil Transmitter PCBA One Stop Custom Service
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Quik Detail
| Model Number | YCT-C109 |
|---|---|
| Type | Controller Board |
| Place of Origin | Guangdong, China |
| Brand Name | YCT |
| Copper Thickness | 1 oz |
| Base Material | FR-4/aluminum/cem-1/cem-3/FR-1 |
| Board Thickness | 1.6mm |
| Min. Hole Size | 0.10mm |
| Min. Line Width | 0.10mm |
| Min. Line Spacing | 0.1mm4mil |
| Surface Finishing | HASL |
| Application | consumer electronics |
| Certificate | ROSH, ISO9001 |
| Solder mask | Green, Blue, Red, Yellow, Black |
| Coil Type | Single Coil |
Product Detail
Product features
(1) Comply with WPC V1.2.3 wireless charging specification
(2) Product standards: EPP certification standards
(3) Supports wireless charging of mainstream mobile phones such as Huawei, Xiaomi, Samsung, and Apple
(4) Use high-performance main control chip, power management chip, low temperature throughout the process
(5) Both cars and trucks can be used directly without a voltage stabilizing module.
(6) High stability, strong compatibility and wide charging range
(7)Input voltage/current: 9V-30V-2A
(8)Output power: 20W/15/10W/7.5W/5W automatic identification
(9) Charging efficiency: about 80%
(10) Sensing distance: <8mm
(11) Working frequency: 100-200Khz
(12) Equipped with four protection functions such as overcurrent, overvoltage, overtemperature and short circuit.
(13)Support dual foreign object detection (FOD)
(14)PCBA board size: length 100mm*width 50mm*thickness 11mm
(15) Magnetic isolation sheet coil size: length 95mm*width 53mm*thickness 3.8mm
Product Description
PCB capacity
| Item | Mass Production | Pilot Run Production |
| Capacity | Capacity | |
| Layer Counts | 1L—18L, HDI | 20-28 , HDI |
| Material | CEM1,CEM3,FR-4, High TG FR4 , Halogen-free FR4 , aluminium ,Ceramic(96% Alumina) | |
| Teflon,PTFE(F4B,F4BK), Rogers(4003,4350,5880)Taconic(TLX-8,TLX-9), Arlon(35N,85N)etc. | ||
| Material Mixed Laminate | 4 layers -- 10 layers | 12 layers |
| FR4+Ro4350 , FR4+Aluminium , FR4+ Polyimide | ||
| Maximum Size | 610mm X 1200mm | 1200 - 2000MM |
| Board Outline Tolerance | ±0.15mm | ±0.10mm |
| Board Thickness | 0.125mm--6.00mm | 0.1mm--8.00mm |
| Thickness Tolerance ( t≥0.8mm) | ± 8% | ±5% |
| Thickness Tolerance( t<0.8mm) | ±10% | ±8% |
| Minimum Line / Space | 0.10mm | 0.075mm |
| Trace width Tolerance | 15%-20% | 10% |
| Minimum Drilling Hole (Mechanical) | 0.2mm | 0.15mm |
| Minimum laser hole | 0.1mm | 0.075mm |
| Hole Position/hole Tolerance | ±0.05mm PTH:±0.076MM NPTH:±0.05mm | |
| Mini hole ring (single | 0.075MM | 0.05MM |
| OutLayer Copper Thickness | 17um--175um | 175um--210um |
| InnerLayer Copper Thickness | 17um--175um | 175um--210um |
| Mini Solder Mask Bridge | 0.05mm | 0.025mm |
| Impedance Control Tolerance | ±10% | ±5% |
| Surface Finishing | HASL, Lead free HASL, Immersion gold, Immersion tin, Immersion Silver. | |
| Plated gold , OSP, Carbon ink, | ||
| Acceptable File Format | ALL Gerber Files,POWERPCB,PROTEL,PADS2000,CAD,AUTOCAD,ORCAD,P-CAD,CAM-350,CAM2000 etc. | |
| Quality Standards | IPC-A-600F and MIL-STD-105D CHINA GB<4588> | |
PCBA Capacity
|
Stencil Size |
736x736mm |
| Minimum IC Pitch | 0.2mm |
| Maximum PCB size | 510X460mm |
| Minimum PCB thickness | 0.5mm |
| Minimum chip size: | 0201 (0.2x0.1)/0603 (0.6 x 0.3mm) |
| Maximum BGA size: | 74x74mm |
| BGA ball pitch: | 1.00mm (minimum), 3.00mm (maximum) |
| BGA ball diameter: | 0.40mm (minimum), 1.00mm (maximum) |
| QFP lead pitch: | 0.38mm (minimum), 2.54mm (maximum) |
| Machine Type | Panasonic CM 402 |
| Panasonic DT301 | |
| Panasonic CM 402 | patch speed:0.06sec/ chip (up to 60,000cph) |
| Patch precision:±0.03~±0.005mm | |
| PCB size:max:510X460mm,min:50X50mm | |
| element size: 0603mm-50X50mm | |
| Panasonic DT301 | patch speed:0.7sec/ chip |
| Patch precision:±0.03~±0.005mm | |
| PCB size:max:510X460mm,min:50X50mm | |
| element size: 1005mm-100X90mmX25mm high speed multifunctional mounter | |
| Volume: | One piece to low volume production quantities |
| Low cost first prototype Fab | |
| Fast deliveries | |
| Assembly type: | SMT assembly |
| DIP assembly | |
| Mixed(surface mount and through hole) technology | |
| Cable assembly | |
| Components type: | Passive components |
| As small as 0402 package | |
| As small as 0201 with design review | |
| Ball Grid Arrays(BGA): | |
| As small as .5mm pitch | |
| Component source | Shar,poshiba, ST, |
| Samsung, Infineon, Ti, | |
| ON,Microchip etc. | |
| Parts procurements: | provide one-stop services |
| Only Assembly service (you supply the parts) | |
| You supply some parts(expensive/important components), we do the rest | |
| Solder type: | Leaded |
| Lead-free/ROHS compliant | |
| Other capabilities: | Repair/rework services |
| Mechanical assembly | |
| Box build | |
| Mold and plastic injection. | |
| Testing Type | First prototype test before mass quantity production |
| AOI | |
| BGA X-ray | |
| PCB E-test | |
| Lead time | According Digikey components delivery time |
A1.What is needed for PCB PCBA quotation?
- PCB: Quantity, Gerber file and Technic requirements(material,surface finish treatment, copper thickness,board thickness ,...)
- PCBA: PCB information, BOM, (Testing documents...)
A2. What file formats do you accept for PCB PCBA production?
- Gerber file: CAM350 RS274X
- PCB file: Protel 99SE, P-CAD 2001 PCB
- BOM: Excel (PDF,word,txt)
A3. Are my files safe?
Your files are held in complete safety and security.We protect the intellectual property for our customers in the whole process.. All documents from customers are never shared with any third parties.
A4. MOQ?
We are able to handle Small as well as large volume production with flexibility.
A5.Shipping cost?
The shipping cost is determined by the destination, weight, packing size of the goods. Please let us know if you need us to quote you the shipping cost.
A6.Component source?
We will use all original if no permission
