customized LM561C LED PCB with 660nm osram led pcb
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Quik Detail
| Model Number | LM561C LED PCB |
|---|---|
| Place of Origin | Guangdong, China |
| Brand Name | HS |
| Base Material | Aluminum Base |
| Copper Thickness | 1-3oz |
| Board Thickness | 0.8-1.6mm |
| Min. Hole Size | 0.2mm |
| Min. Line Width | 0.1mm |
| Min. Line Spacing | 0.1mm |
| Surface Finishing | HASL OSP ENIG |
| Production name | LED PCB |
| Number of layer | 1layer |
| Certification | CE UL ROHS ISO9001 |
| Warranty | 2 years |
| Dsign service | Available |
| Testing | Function testing |
| Delivery | DHL Fedex UPS EMS |
| Solder mask | White Black Green Blue Red,etc. |
| Other service | Components purchase and assamble |
| PCB clone | acceptable |
Product Detail
customized LM561C LED PCB with 660nm osram led pcb
We can do for you:
♦ 1—12 layer FR4 PCB,1 layer Aluminum PCB,1-4 layer Flexible PCB.
♦ 1—3oz copper thickness.
♦ 0.2mm hole size.
♦ 0.1mm track width/space.
♦ SMT PCBA service.
FAQ:
Q:1.Can i have a sample to test?
A:Yes,we can send you samples to test.
Q:2.What specifications do you need for PCB quotation?
A:We need your PCB Gerber file,board thickness,copper thickness,surface finishing and quantity to quote you.
Q:3.What is the lead time?
A:Samples need 3-5days,mass production needs 7-10days,also according to the order volume.
Q:4.Do you have MOQ limit?
A:Even 1 pcs,we care.
Q:5.Can you offer the best price for us?
A:Yes,we are specialized PCB manufacturer directly,we can offer lower price than any trading company.
Q:6.How do you ship the goods and how long does it take arrival?
A:We usually ship by DHL,UPS,FedEx and TNT.It takes 3-5days to arrive.
Q:7.What are the payment terms?
A:You can pay us with Paypal,Western Union and T/T Bank.
Q:8.Can we visit your factory?
A:Yes,welcome to visit our factory anytime,and we will lead you to visit our factory and our production line.
Manufacturing Capability:
|
item |
Manufacture Capability |
|
Material |
FR4,CEM-1, Aluminium, Polyamide |
|
Layer No. |
1-12 |
|
Finished board thickness |
0.1 mm-4.0mm |
|
Board Thickness Tolerance |
±10% |
|
Cooper thickness |
0.5 OZ-3OZ (18 um-385 um) |
|
Copper Plating Hole |
18-40 um |
|
Impedance Control |
±10% |
|
Warp&Twist |
0.70% |
|
Peelable |
0.012"(0.3mm)-0.02’(0.5mm) |
|
Images |
|
|
Min Trace Width (a) |
0.075mm (3mil) |
|
Min Space Width (b) |
0.1mm (4 mil) |
|
Min Annular Ring |
0.1mm (4 mil) |
|
SMD Pitch (a) |
0.2 mm(8 mil) |
|
BGA Pitch (b) |
0.2 mm (8 mil) |
|
Solder Mask |
|
|
Min Solder Mask Dam (a) |
0.0635 mm (2.5mil) |
|
Solder mask Clearance (b) |
0.1mm (4 mil) |
|
Min SMT Pad spacing (c) |
0.1mm (4 mil) |
|
Solder Mask Thickness |
0.0007"(0.018mm) |
|
Holes |
|
|
Min Hole size (CNC) |
0.2 mm (8 mil) |
|
Min Punch Hole Size |
0.9 mm (35 mil) |
|
Hole Size Tol (+/-) |
PTH:±0.075mm;NPTH: ±0.05mm |
|
Hole Position Tol |
±0.075mm |
|
Plating |
|
|
HASL |
2.5um |
|
Lead free HASL |
2.5um |
|
Immersion Gold |
Nickel 3-7um Au:1-5u'' |
|
OSP |
0.2-0.5um |
|
Outline |
|
|
Panel Outline Tol (+/-) |
CNC: ±0.125mm, Punching: ±0.15mm |
|
Beveling |
30°45° |
|
Gold Finger angle |
15° 30° 45° 60° |
|
Certificate |
ROHS, ISO9001:2008, SGS, UL certificate |
