shenzhen customized aluminum led pcba manufacturer OEM LM301B LED PCB supplier
US $22.00 / piece
1 piece(s)Minimum order
Model Number:
Customized
Type:
LED pcb
Place of Origin:
Guangdong, China
Brand Name:
HS
Base Material:
Aluminum
Copper Thickness:
1-3oz
Privacy Policy:
Samples are free within a certain price range
Other recommendations for your business
$30.00-32.00
5 pieces (MOQ) 
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2 pieces (MOQ) Contact us
Quik Detail
| Model Number | Customized |
|---|---|
| Type | LED pcb |
| Place of Origin | Guangdong, China |
| Brand Name | HS |
| Base Material | Aluminum |
| Copper Thickness | 1-3oz |
| Board Thickness | 0.4-2.0mm |
| Min. Hole Size | 0.3mm |
| Min. Line Width | 0.2mm |
| Min. Line Spacing | 0.2mm |
| Surface Finishing | HASL ENIG OSP |
| Board Size | 1000*1200MM |
| PCB name | ALUMINUM |
| Number of layer | 1-2layer |
| Certificaion | CE ROHS ISO9001 |
| Warranty | 3years |
| Design service | Available |
| Testing | Function testing |
| Delivery | DHL FedEx UPS |
| Solder mask | White Black. |
| Other service | SMT and DIP assembly |
| PCB clone | Acceptable |
Product Detail
Circuit Boarde Service And FR4 PCB Assembly PCB PCBA Custom Board Design
Product Description
PCB name | FR4 PCB | Warranty | 3years |
Solder mask | White Black | PCB clone | Acceptable |
Number of layer | 1-2layer | Other service | SMT and DIP assembly |
PCB Assembly Capability Advantages
----Professional Surace-mounting and Through-hole soldering technology
----Various sizes like 1206,0805,0603 components SMT technology
----ICT(In Circuit Test),FCT(Functional Circuit Test)
----PCB Assembly With UL,CE,FCC,Rohs Approval
----Nitrogen gas reflow soldering technology for SMT.
----High Standard SMT&Solder Assembly Line
----High density interconnected board placement technology capacity.
----Various sizes like 1206,0805,0603 components SMT technology
----ICT(In Circuit Test),FCT(Functional Circuit Test)
----PCB Assembly With UL,CE,FCC,Rohs Approval
----Nitrogen gas reflow soldering technology for SMT.
----High Standard SMT&Solder Assembly Line
----High density interconnected board placement technology capacity.
